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• Never comingle leaded and lead-free components in inventory or applications. Although maintaining dual inventories and manufacturing lines can be costly, the costs of failures can be far greater.
• Stay informed about research on solder alloys being tested to replace tin-lead. Although none yet is a proven replacement for tin-lead, research may soon yield an acceptable sub- stitute that will meet high-reliability requirements.
Below are some relevant standards:
• GEIA-STD-0005-1,"Performance Standard for Aerospace and High Performance
Electronic Systems Containing Lead-free Solder"
• GEIA-STD-0005-2,"Standard for Mitigating the Effects of Tin Whiskers in Aerospace in
High Performance Electronic Systems"
• GEIA-STD-0005-3,"Performance Testing for Aerospace and High Performance
Electronic Interconnects Containing Lead-Free Solder and Finishes"
• GEIA-HB-0005-1,"Program Management/Systems Engineering Guidelines for
Managing the Transition to Lead-Free Electronics"
• GEIA-HB-0005-2,"Technical Guidelines for Aerospace and High Performance Electronic
Systems Containing Lead-Free Solder and Finishes"
• GEIA-HB-0005-3,"Rework and Repair Handbook for Aerospace and High Performance
Electronic Systems Containing Heritage SnPb and Lead-Free Solder and Finishes"
• GEIA-HB-0005-4,"Impact of Lead Free Solder on Aerospace Electronic System
Reliability and Safety Analysis"
• ASTM F2725-08,"Standard Guide for European Union's Registration, Evaluation, and
Authorization of Chemicals (REACH) Supply Chain Information Exchange."
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