SD-2 Dod Acquisitions Buying Commercial Items And Nondevelopmental ItemsThis document offers guidance on acquisitions involving all types of commercial and nondevelopmental items: systems, subsystems, assemblies, parts, and items of supply. Commercial services are also addressed.This document does not present a “cookbook” approach to the acquisition of commercial and nondevelopmental items; such an approach could not accommodate the vast array of potential applications. It does offer lessons learned and things to consider when participating on an integrated product team.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41 - 42 - 43 - 44 - 45 - 46 - 47 - 48 - 49 - 50 - 51 - 52 - 53 - 54 - 55 - 56 - 57 - 58 - 59 - 60 - 61 - 62 - 63 - 64

I                                                ,                                   -                            J'

·�

•  IDEA-STD-1010-A,"Acceptability of Electronic Components Distributed in the Open

Market."

For more information, see DeJense Industrial Base Assessment: CounterJeit Electronics, published by the U.S. Department of Commerce in January 2010.

Components without Leaded Solder and Finishes

The Problem

DoD and the U.S. aerospace industry want electronic components, particularly those used in applications requiring high-reliability performance, that are made with leaded solder and finish- es. However, finding such components is difficult because of various bans on the use of lead. Without lead, solder is more brittle and, therefore, may not be able to handle mechanical stress- es such as the g-force created when spacecraft lift off.

Lead-free finishes can be problematic because of the risk of tin whiskers.Tin whiskers are elongated, electrically conductive crystalline structures that grow spontaneously from pure-tin surfaces.Tin whiskers have caused failures in electronics by short-circuiting to adjacent conduc- tors. Aircraft, satellites, and missiles also have failed due to tin-whisker short circuits. In 1998, a

$250 million Galaxy IV communications satellite was lost after two processors failed; the back- up satellite could not be used because tin whiskers had shorted it out a year before. At least 10 other satellite failures have been blamed on tin whiskers. Most tin whisker-related failures occur after 1 to 3 years of service, early in the life cycle of defense weapon systems.

Risk Factors

The risks related to leaded versus lead-free components are twofold: the difficulty of finding manufacturers that will produce electronic components using lead solder and finishes, and the difficulty of distinguishing between parts that appear to be identical but are, in fact, different in terms of their lead content-some are lead free while others are not.

Lead has long been known as hazardous to humans and the environment, and its use has, for many years, been banned in plumbing, coatings, gasoline, paint, and other products. In an effort to further reduce the risks, the European Union nations sought to reduce the amount of lead

in the manufacturing process by issuing the RoHS and WEEE directives, which became Euro- pean law in 2003. Beginning on July 1, 2006, the European Union began banning the import of electronic components that include lead and other heavy metals.The United States, Japan, China, South Korea, Argentina, and Australia have taken similar measures.

To be able to sell parts to countries in Europe and beyond, and to remain competitive, man- ufacturers must comply with the RoHS and WEEE directives.The RoHS and WEEE directives do not apply to defense and aerospace products. However, the defense and aerospace industries